基于DD-OSBPD模型的耐火材料热震损伤分析

A fully coupled thermal-mechanical model based on damage dependent ordinary state-based peridynamics (DD-OSBPD) was proposed. In this model, the new surface effects caused by crack damage due to bond breakage were considered, a bond damage correction factor was introduced and a secondary correction was made to the surface correction factor to enhance the computational accuracy of the peridynamics (PD) model at crack damage positions. Additionally, the OpenMP parallel computing technology was employed to implement the numerical calculations for this model. The thermal-mechanical coupling problem of a centrally cracked plate subjected to uniform tensile loading was simulated with the DD-OSBPD thermal-mechanical coupling model, the ordinary state-based peridynamic (OSBPD) thermal-mechanical coupling model and the finite element method, respectively. The results validate the effectiveness of the DD-OSBPD thermal-mechanical coupling model. With the DD-OSBPD thermal-mechanical coupling model, the crack damage propagation in ceramic plates at various quenching temperatures was simulated, and the impact of different quenching temperatures on the material's thermal shock resistance was investigated. Comparison between numerical simulations with experimental studies show the same crack propagation patterns in good agreement, which further confirms the correctness of the model.