Solderability Tests Toward Miniaturized Microelectronics: Applicability and Limitations of Micro-Wetting Balance Testing of SnAgCu and SnBi Solders
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Welding Techniques and Residual Stresses
Electrodeposition and Electroless Coatings
Publication details
- Journal / source
- Publications of the UdS (Saarland University)
- Publication date
- 1 January 2026
- Language
- EN