High-Temperature-Resistant Joining with a Ni-Nanoparticle/Al-Microparticle Hybrid Bonding Material

JOURNAL OF THE JAPAN WELDING SOCIETY 2026

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Authors: Kohei TATSUMI, Norihiro Murakawa, Keiko Koshiba

DOI: 10.2207/jjws.95.56

Cited by: 0

References: 8

Fields of Study & Subjects

Advanced Welding Techniques Analysis Electronic Packaging and Soldering Technologies Welding Techniques and Residual Stresses

References 8