A Coupled Multiphysics and CFD based Curing Model for Predicting Warpage and Residual Stress in Fiber-Reinforced Composites

The article presents a methodology for CFD based curing process modeling for thermoset composite material parts. In the first part, the variability of heat transfer coefficient (HTC) is calculated on the surface of the part and mold using the Conjugate Heat Transfer (CHT) analysis within the CST® studio portfolio. For the subsequent analysis, the distribution of film coefficient is mapped to the Abaqus® structural solver for curing simulation and predicting the residual stress and warpage. This combined workflow is demonstrated using the U-shaped composite bracket and based on the integrated multiphysics-multiscale modeling framework available within SIMULIA® solution portfolio.