Thermally Stable Method of Attaching Precision Thin Films to Deployable Structures Using High Strain Kirigami Borders

A novel method of continuously attaching thin films to deployable thin shell structures, allowing for widely different coefficients of thermal expansion, is presented. This paper proposes a double s-spring border that exhibits a local post-buckling behavior and provides a tunable continuous edge attachment method that can maintain constant preload under large thermal strains. The mechanical behavior of the double s-spring under different mechanical loading conditions is studied both numerically and experimentally.