High aspect ratio vertically aligned copper nanowire composites as thermal interface materials for improved electronics cooling

Stanford Digital Repository 2026 Thesis Open access

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Authors: Hansen Qiao, Kenneth E. Goodson, Fritz B. Prinz, Eric Pop, Stanford University. School of Engineering., Stanford University. Department of Material Sci & Engineering.
DOI: 10.25740/yf761kd8662
Cited by: 0

Fields of Study & Subjects

Thermal properties of materials Heat Transfer and Boiling Studies Nanomaterials and Printing Technologies

Publication details

Journal / source
Stanford Digital Repository
Publication date
17 January 2026
Document type
Thesis