Solution-Processing of Metal-Organochalcogenides (MOCs) and Application in Thin-Film Transistors

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Authors: Pongkamon Prayongkul, Saran Waiprasoet, Akinori Saeki, Phakawan Thinsoongnoen, Thanasee Thanasarnsurapong, Petcharaphorn Chatsiri, Rattapon Khamlue, Vinich Promarak, Watcharaphol Paritmongkol, Adisak Boonchun, David J. Harding, Kanokwan Kongpatpanich
+1 more Pichaya Pattanasattayavong
Cited by: 1

Abstract

Metal-organochalcogenides (MOCs) have recently emerged as highly promising candidates for optoelectronic applications; however, their integration into devices has been severely limited by the lack of solution-processable routes, as most MOCs are insoluble in conventional solvents. Herein, we report a strategy that employs coordinating diamine solvents to solubilize and process four metal–thiophenolate complexes as a model group of MOCs, enabling the fabrication of high-quality thin films. A high solubility of 150-200 mg mL -1 (>600 mM) can be achieved with 1,3-diaminopropane (DAP). Using copper thiophenolate (CuSPh) as a model system, we elucidate the role of DAP acting as a liquid co-ligand for the dissolution and validate the restoration of the MOC structure upon solvent removal. DAP-based solutions allow for the fabrication of smooth, compact, and uniform films with thickness between 30-40 nm. Notably, solution-processed films of CuSPh with the underlying one-dimensional (1D) structure are demonstrated as a semiconducting p-channel in field-effect transistors, achieving a hole mobility of 5×10 -3 cm 2 V -1 s -1 which is comparable to single-crystalline nanorods of CuSPh. Our ‘ liquid ligand processing ’ concept provides a route for fabricating MOC films using standard solution-based methods and crucially unlocks the applications of MOCs in thin-film devices.

Fields of Study & Subjects

2D Materials and Applications Organic Electronics and Photovoltaics Semiconductor materials and interfaces

Publication details

Journal / source
ChemRxiv
Publisher
American Chemical Society (ACS)
Publication date
12 May 2026
Document type
Preprint