Research on the Polishing Technology of Diamond Semiconductor Substrate Material

This paper primarily examines three distinct diamond polishing techniques: mechanical polishing, thermal chemical polishing, and laser polishing.As the demand for high-performance diamond semiconductors grows in advanced electronics and optics, efficient and precise polishing methods have become critical to achieving optimal material performance.A comprehensive comparison of these techniques is essential to address the trade-offs between processing efficiency, surface quality, and cost, thereby advancing diamondbased applications in extreme environments.The study analyzes the advantages and disadvantages of these techniques and provides guidance on selecting the most suitable method.Diamond is a crucial semiconductor material; however, its high hardness makes it challenging to process and polish.Different polishing techniques are required for diamonds of different shapes.Mechanical polishing is simple and efficient but can damage the sub-surface of the diamond at high speeds.Laser polishing has achieved significant success in precise polishing, but the difficulty in controlling laser energy can lead to damage or loss.Thermal chemical polishing can produce low-damage surfaces with high removal efficiency, but its complex equipment and environmental limitations restrict its application.