A Step Toward Automation in Failure Analysis by FIB-SEM 3D Tomography and AI Segmentation

EDFA Technical Articles 2026

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Authors: Pascal Limbecker, Rong Wu, Thomas Woyack, Heiko Stegmann, Daniel Plencner, Roland Salzer
DOI: 10.31399/asm.edfa.2026-1.p003
Cited by: 0

Abstract

Abstract This article looks at ways to automate FIB-SEM slice and view, dataset post-processing and visualization, and automated defect detection. Virtual slicing in all directions, especially in the top-down view, facilitates the interpretation of defect types and the identification of root causes. Automated slice and view capabilities can save resources and maximize tool utilization.

Fields of Study & Subjects

Integrated Circuits and Semiconductor Failure Analysis Advanced Materials Characterization Techniques Advanced Electron Microscopy Techniques and Applications

Publication details

Journal / source
EDFA Technical Articles
Volume
28
Issue
1
Pages
3–10
Publication date
1 February 2026
Language
EN