ISTFA 2025 Highlights

EDFA Technical Articles 2026

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DOI: 10.31399/asm.edfa.2026-1.p022
Cited by: 0

Abstract

Abstract This article provides a recap of the 51st International Symposium for Testing and Failure Analysis (ISTFA), which was held in Pasadena from November 16-20, 2025. It includes Conference Chair Renee Parente's wrap-up, a list of the winning ISTFA papers and posters, and highlights from panel sessions and user group meetings.

Fields of Study & Subjects

Integrated Circuits and Semiconductor Failure Analysis VLSI and Analog Circuit Testing Electronic Packaging and Soldering Technologies

Publication details

Journal / source
EDFA Technical Articles
Volume
28
Issue
1
Pages
22–34
Publication date
1 February 2026
Language
EN