MODELING OF THE LIQUID COOLING SYSTEM FOR HIGH-POWER ELEMENTS OF TECHNICAL MEANS

The article evaluates the efficiency of a liquid cooling system designed for high- powercomponentsofmoderncomputingsystems,includingthecentralprocessingunit(CPU), memorychips,andgraphicsprocessingunit(GPU).Toachievethis,adetailedthree-dimensional model of a personal stationary computer was developed using the Solid Edge (Siemens) soft- ware environment. The study employed the FloEFD (Flow Simulation) module to simulate hydrodynamics and heat transfer processes, enabling accurate analysis of thermal perfor- mance. Key parameters such as ambient temperature (ranging from 263 K (-10°C) to 313 K (40°C)), type of refrigerant (water (H2O), EK-CryoFuel, and Koolance LIQ-702), and the number of operational fans (one to three) were systematically investigated to determine their impact on cooling efficiency. The results provide insights into optimizing liquid cooling sys- tems under varying environmental and operational conditions, offering valuable guidance for improving thermal management in high-performance computing environments. This research highlights the importance of considering multiple factors when designing efficient cooling so- lutions for advanced technical systems.