Reducing Stress Shielding in Cementless Total Hip Arthroplasty: A Translational Review of the Gradient-Modulus Ti-Nb-Sn Femoral Stem

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Authors: Yu Mori, Hidetatsu Tanaka, Kazuyoshi Baba, Ryuichi Kanabuchi, Naoko Mori, Toshimi Aizawa
Cited by: 1
References: 89

Abstract

Stress shielding (SS) after cementless total hip arthroplasty arises from the stiffness mismatch between conventional Ti-6Al-4V femoral stems (110 GPa) and cortical bone (10–30 GPa). The β-type Ti-33.6Nb-4Sn (TNS) alloy femoral stem addresses this limitation through a continuous Young’s modulus gradient (~70 GPa proximally to ~40 GPa distally) achieved by localized heat treatment of a single homogeneous alloy. This review synthesizes a translational research program encompassing material characterization, finite element modeling (FEM), preclinical animal studies, and prospective clinical follow-up of up to seven years. FEM demonstrated favorable proximal micromotion well below the osseointegration threshold, with physiological proximal stress concentration concordant with clinical outcomes. At seven years, SS grade distribution was significantly lower in the TNS group than in Ti-6Al-4V controls, with SS frequency reduced in Gruen Zones 2, 3, and 6, and no stem-related failures; however, third-degree SS was still observed in 11 of 34 evaluable cases (32%), indicating that modulus-gradient optimization alone is insufficient to fully prevent SS. TNS alloy is currently the only β-type titanium alloy clinically applied in joint prostheses. Remaining challenges include stem geometry optimization, additive manufacturing-based porous structures, and dual-energy X-ray absorptiometry-based bone density quantification. Future directions encompass long-term follow-up, cyclic fatigue FEM simulations, and expansion to fracture fixation devices and dental implants.

Fields of Study & Subjects

Orthopaedic implants and arthroplasty Titanium Alloys Microstructure and Properties Orthopedic Infections and Treatments

Publication details

Journal / source
Applied Sciences
Publisher
MDPI AG
Volume
16
Issue
11
Pages
5630–5630
Publication date
4 June 2026
Language
EN