A Survey of Multi-Layer IoT Security Using SDN, Blockchain, and Machine Learning

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Authors: Reorapetse Ramoliti Samuel Molose, Bassey Isong
Cited by: 1
References: 76

Abstract

The integration of Software-Defined Networking (SDN), blockchain (BC), and machine learning (ML) has emerged as a promising approach to securing Internet of Things (IoT) and Industrial IoT (IIoT) networks. This paper conducted a comprehensive review of recent studies focusing on multi-layered security across device, control, network, and application layers. The analysis reveals that BC technology ensures decentralised trust, immutability, and secure access validation, while SDN enables programmability, load balancing, and real-time monitoring. In addition, ML/deep learning (DL) techniques, including federated and hybrid learning, strengthen anomaly detection, predictive security, and adaptive mitigation. Reported evaluations show similar gains in detection accuracy, latency, throughput, and energy efficiency, with effective defence against threats, though differing experimental contexts limit direct comparison. It also shows that the solutions’ effectiveness depends on ecosystem factors such as SDN controllers, BC platforms, cryptographic protocols, and ML frameworks. However, most studies rely on simulations or small-scale testbeds, leaving large-scale and heterogeneous deployments unverified. Significant challenges include scalability, computational and energy overhead, dataset dependency, limited adversarial resilience, and the explainability of ML-driven decisions. Based on the findings, future research should focus on lightweight consensus mechanisms for constrained devices, privacy-preserving ML/DL, and cross-layer adversarial-resilient frameworks. Advancing these directions will be important in achieving scalable, interoperable, and trustworthy SDN-IoT/IIoT security solutions.

Fields of Study & Subjects

Software-Defined Networks and 5G Blockchain Technology Applications and Security IoT and Edge/Fog Computing

Publication details

Journal / source
Electronics
Publisher
MDPI AG
Volume
15
Issue
3
Pages
494–494
Publication date
23 January 2026
Language
EN