Characterization of SUEX Dry Film for 5G Applications

Fifth-Generation (5G) communication systems necessitate highly integrated technologies to facilitate ultra-fast data rates, low latency, and compact system configurations. The realization of these objectives depends on the advancement of packaging techniques, such as System-on-Package (SoP), wherein low-loss build-up layers play a vital role in enhancing signal transmission. In this context, the electrical characterization of a 25 μm thick SUEX dielectric material used as a build-up layer for SoP applications is presented. Various test structures, including microstrip ring resonators (MRRs), coplanar waveguides (CPWs), and microstrip lines (MSs), are fabricated and measured over a frequency range of 1–30 GHz. The electrical properties are extracted using MRRs, whereas CPW and MS line structures are utilized for characterization and validation. The measurement results indicate that while the average dielectric constant of the SUEX dry film ranges from 3.07 to 3.10, the corresponding loss tangent varies between 5.75 × 10−3 and 5.83 × 10−3 across a frequency range of 10.28–27.47 GHz. These results verify that SUEX has low-loss properties, making it a suitable dielectric for build-up layers in SoP modules, where reducing signal loss is crucial for 5G and future communication technologies.