UPSET: A Comprehensive Probabilistic Single Event Transient Analysis Flow for VLSI Circuits Using Static Timing Analysis

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Authors: Christos Georgakidis, Dimitris Valiantzas, Nikolaos Chatzivangelis, Marko Andjelković, Christos Sotiriou, Miloš Krstić
Cited by: 4
References: 52

Abstract

The downscaling of VLSI technologies has exacerbated the susceptibility of integrated circuits (ICs) to radiation-induced Single-Event Transients (SETs). This work presents UPSET, a comprehensive and technology-independent EDA framework for probabilistic SET analysis using Static Timing Analysis (STA). Unlike traditional simulation-based methods that suffer from prohibitive runtimes, UPSET leverages graph-based propagation with advanced logical, electrical, and timing-window masking models to evaluate circuit sensitivity efficiently. Key contributions include a novel “Electrical Masking Window” (EMW) criterion that effectively filters non-full-rail pulses early in reconvergent logic and a TimeStamp-based propagation mode that accurately handles complex signal reconvergence with Boolean evaluation. The experimental results over some featured benchmarks demonstrate a speedup of more than 25,000× compared with SPICE while maintaining a tight 4.56% error bound in pulse width estimation. Moreover, experimental validation on 50 benchmarks across varying complexities showcases that EMW enhancement reduces the pessimism to circuit sensitivity by up to 25% on average, providing tighter upper bounds while maintaining scalability to million-gate designs. By integrating seamlessly with standard industrial formats (LEF, DEF, LIB, or SPEF), UPSET enables scalable, accurate soft SET sensitivity assessment for modern digital designs, establishing a robust foundation for automated radiation hardening flows.

Fields of Study & Subjects

Radiation Effects in Electronics Low-power high-performance VLSI design Physical Unclonable Functions (PUFs) and Hardware Security

Publication details

Journal / source
Electronics
Publisher
MDPI AG
Volume
15
Issue
4
Pages
818–818
Publication date
13 February 2026
Language
EN