Advanced Machine Learning Approach for Fast Temperature Estimation in SiC-Based Power Electronics Converters

Read full text
Authors: Kalle Bundgaard Troldborg, Sigurd Illum Skov, Arman Fathollahi, Jørgen Houe Pedersen
Cited by: 6
References: 54

Abstract

Accurate and fast junction-temperature estimation in Silicon Carbide (SiC) power modules is crucial for reliable operation, health monitoring and predictive control of power electronic converters in different applications. However, direct temperature measurement inside the module is difficult and high-fidelity thermal models are often very computationally expensive for real-time implementation. This paper proposes a digital twin development approach for fast and accurate temperature estimation in all three dimensions of a SiC MOSFET power module by a combination of finite element method (FEM) modelling and neural networks. The work is especially relevant in thermal monitoring and managing power electronics converters such as renewable energy systems, energy storage systems, Electric Vehicles (EV), etc. The model incorporates a neural network trained on data generated from an FEM model built in COMSOL Multiphysics. The developed digital twin can estimate the temperature distribution, including the ten junction temperatures of the Wolfspeed EAB450M12XM3 module, with an average estimation time of 0.063 s, enabling predictive control. In order to improve practical applicability and model synchronization with the physical system, NTC-based feedback techniques are discussed (single-Temperature Coefficient (NTC) and double-NTC approaches). The proposed framework is investigated in terms of prediction accuracy and computational performance related to the FEM-generated reference data. The approach improves model reliability by adjusting the parameters of the critical digital and physical modules. The combination of FEM-based modelling and machine learning can provide a foundation for accurate, real-time thermal monitoring in power electronic modules.

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Photovoltaic System Optimization Techniques Thermal Analysis in Power Transmission

Publication details

Journal / source
Electronics
Publisher
MDPI AG
Volume
15
Issue
6
Pages
1325–1325
Publication date
22 March 2026
Language
EN