Double-Sided Mixed-Coupling Wireless Power Transfer with Independent Electric and Magnetic Path

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Authors: G. S. Kim, Sang-Wook Park
Cited by: 1

Abstract

Compact wireless electronic devices require charging interfaces that can support different receiver positions and orientations within limited spaces. In this context, a double-sided mixed-coupling structure can provide independent magnetic- and electric-field power-transfer paths by combining coil-based and plate-based coupling mechanisms. This paper proposes a double-sided mixed-coupling wireless power transfer (DMPT) coupler for compact wireless electronic devices related to the Internet of Things (IoT) and the Internet of Drones (IoD). The proposed coupler integrates an upper coil-based magnetic-field coupling path and a lower stacked-plate-based electric-field coupling path within a single transmitter structure. Through this configuration, inductive wireless power transfer (IPT) and capacitive wireless power transfer (CPT) are implemented as independent double-sided power-transfer paths. To analyze the resonant behavior, a three-port equivalent circuit including mutual inductance and mutual capacitance is developed, and the resonance splitting under the uncompensated condition is investigated using even/odd mode decomposition. The predicted resonant frequencies agree with the ANSYS HFSS results with errors of 0.16% and 1.12%. After series-L compensation, the 60 × 60 × 7.31 mm3 coupler operates at the 6.78 MHz industrial, scientific, and medical band, showing S11 ≈ 0.042, S21 ≈ 0.68, and S31 ≈ 0.64 under the double-sided aligned condition. Field and transient waveform analyses further verify that the upper H-coupling region and lower E-coupling region operate simultaneously while being spatially separated. The proposed DMPT coupler provides a coupler-level design framework for implementing IPT and CPT as independent double-sided coupling paths.

Fields of Study & Subjects

Wireless Power Transfer Systems Energy Harvesting in Wireless Networks RFID technology advancements

Publication details

Journal / source
Electronics
Publisher
MDPI AG
Volume
15
Issue
13
Pages
2938–2938
Publication date
5 July 2026
Language
EN