Novel Glue-Stabilized Sorbent Layers for Adsorption Chillers: Thermal and Sorption Characteristics

Adsorption chillers can produce chilled and desalinated water using low-grade heat, but their performance is limited by low coefficient of performance (COP) and large system mass. Enhancing heat and mass transfer in the sorbent bed is key to improving efficiency. This work introduces and systematically evaluates binder-stabilized silica gel composites as a structural and thermal enhancement strategy for adsorption chillers. Silica gel composites bonded with epoxy resin and polyvinyl alcohol (PVA) were evaluated for adsorption chiller applications. Thermal stability, conductivity, microstructure, equilibrium sorption, and sorption hysteresis were assessed. The results indicate that PVA-based composites were thermally unstable and discarded, whereas epoxy-bonded silica gel showed high thermal stability and mechanically robust granules with preserved pore connectivity. The epoxy composite exhibited 109% higher thermal conductivity than loose silica gel, improving internal heat transfer. This improvement is accompanied by a reduction in sorption capacity of approximately 58%, attributable to the inert resin fraction. Notably, the composite exhibits a reduced and locally negative sorption hysteresis, indicating facilitated desorption and lowered internal diffusion resistance. The epoxy-bonded silica gel therefore provides a promising combination of thermal stability, improved heat transfer, and enhanced sorption–desorption behaviour, supporting its potential to increase the efficiency of next-generation adsorption chillers.