Tailoring Microstructure and Performance of Cu/SiC Composites via Integrated Powder Metallurgy and Thermo-Compression Processing

Read full text
Authors: Mohammad Shan, Sajjad Arif, Muhammad Khairi Faiz, Mohd Ridha MUHAMAD, Ateyah Alzahrani, Ahmad Alghamdi, Anwar Ulla Khan
Cited by: 3
References: 56

Abstract

This study reports the fabrication and characterization of copper–silicon carbide (Cu–SiC) metal matrix composites produced using powder metallurgy (PM) combined with thermo-compression processing (TCP), a dual route that remains limited in Cu–SiC research. Micro-sized SiC particles (1–25 wt.%) were incorporated into Cu, compacted, sintered, and subsequently subjected to sequential forging and annealing. Unlike conventional PM-only processing, TCP significantly reduced porosity, promoted more uniform reinforcement dispersion, and relieved residual stresses, creating a strong synergy between densification and microstructural refinement. SEM, EDS, XRD, and Raman analyses confirmed phase stability, homogeneous reinforcement distribution, and the absence of deleterious interfacial phases. The integrated PM + TCP route achieved an ultimate tensile strength of ~209 MPa, hardness of ~65 HRB, and toughness of ~35 MJ/m3 at approximately 3 wt.% SiC. The superior performance at this composition resulted not from the lowest porosity but from the combined effects of uniform particle dispersion, improved particle–matrix bonding, and deformation-driven refinement. These findings establish TCP as an effective post-sintering strategy that overcomes intrinsic porosity and interfacial limitations in Cu–SiC composites. Overall, powder metallurgy combined with the thermo-compression processing is identified as a promising processing pathway for developing high-strength, thermally stable Cu–SiC materials for structural and thermal management applications.

Fields of Study & Subjects

Aluminum Alloys Composites Properties Powder Metallurgy Techniques and Materials Microstructure and mechanical properties

Publication details

Journal / source
Materials
Publisher
MDPI AG
Volume
19
Issue
2
Pages
243–243
Publication date
7 January 2026
Language
EN