Optimizing Rheology and Structure of Silver Pastes for Screen-Printed Silicon Solar Cells

Read full text
Authors: Baisen Hou, Zhiqiang Xia, Zhen Pang, Xinyu Zhou, Zhuo Qian, Wei Li, Mengyao Chai, Jiantao Yin, Junpeng Li, Xianglei Yu, Guoyou Gan
Cited by: 1
References: 37

Abstract

Solar energy, as a clean and renewable resource, plays a pivotal role in advancing sustainable energy technologies. The efficiency of front-side silver paste is critical for the photovoltaic performance of Tunnel Oxide Passivated Contact (TOPCon) solar cells. In this study, we comprehensively investigated how the composition of organic vehicles in conductive pastes influences both printing rheological properties and electrical performance. Through rheological characterization, contact angle measurements, and Three-Interval Thixotropy Tests (3ITT), we examined the effects of varying solvent, binder, and thixotropic agent ratios on paste properties. The optimized formulation-a solvent mixture of lauryl alcohol ester (TE), butyl carbitol (DGME), butyl carbitol acetate (BCA), and dibutyl phthalate (DBP) in a 3:4:2:1 ratio, with ethyl cellulose (EC) STD10 as the binder and a polyamide wax (PAW)-hydrogenated castor oil (HCO) thixotropic agent at a 3:1 mass ratio-demonstrated superior viscosity control and rapid structural recovery. Printed grid lines achieved a height-to-width ratio (H/W) of 0.35 and a sheet resistance (Rs) of 1.43 Ω/□. These findings reveal direct relationships between organic vehicle composition, paste rheology, and functional performance, providing practical guidance for the design and optimization of high-performance conductive pastes for c-Si solar cells. This work establishes a foundation for improving both the efficiency and reliability of next-generation silver paste formulations in photovoltaic applications.

Fields of Study & Subjects

Nanomaterials and Printing Technologies Silicon and Solar Cell Technologies Thin-Film Transistor Technologies

Publication details

Journal / source
Materials
Publisher
MDPI AG
Volume
19
Issue
5
Pages
918–918
Publication date
27 February 2026
Language
EN