Adhesives and Sealants in Packaging: Advanced Materials, Performance, and Emerging Technologies (Part II)

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Authors: Calogero Volpe, Leonardo Pagnotta
Cited by: 1
References: 160

Abstract

This second part extends the system-level framework established in Part I by examining advanced adhesive and sealant technologies through a performance-, circularity-, and application-oriented perspective relevant to contemporary packaging systems. While Part I focused on material classification, bonding and sealing mechanisms, regulatory aspects, and interfacial design principles, the present review analyses how advanced adhesive and sealant systems behave under realistic converting, sealing, service, recycling, and end-of-life conditions. Particular attention is devoted to bio-based and compostable adhesives, recyclable mono-material architectures, advanced multilayer sealants, debond-on-demand systems, and smart or reversible interfaces designed to support circular packaging strategies. The review critically discusses the principal adhesive and sealant performance metrics-including bond strength, seal strength, seal initiation temperature (SIT), hot-tack behaviour, cohesive durability, processing robustness, and hydrothermal resistance-in relation to packaging reliability, barrier preservation, processability, and compatibility with industrial converting operations. The analysis additionally addresses interfacial failure mechanisms, recyclability constraints associated with multilayer structures, food-contact compliance, migration and non-intentionally added substances (NIAS), and the growing role of design-for-disassembly and circularity-oriented interfacial engineering. Emerging transition strategies involving waterborne systems, low-migration formulations, recyclable sealants, dynamic covalent networks, and controlled debonding technologies are evaluated in terms of their potential to reconcile packaging performance with sustainable material management. By integrating material-specific developments with system-level packaging considerations, this review highlights how adhesive and sealant interfaces increasingly represent critical design variables governing the balance between mechanical performance, sealing reliability, processability, recyclability, compostability, and circularity in next-generation packaging systems.

Fields of Study & Subjects

Polymer Science and PVC Polymer composites and self-healing Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Materials
Publisher
MDPI AG
Volume
19
Issue
15
Pages
3320–3320
Publication date
4 August 2026
Language
EN