Cold Metal Transfer-Based Wire Arc Additive Manufacturing of Al–Si Alloys: Technology Principles, Process Control, Material Behaviour and Defect Formation

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Authors: Gabriela Rodriguez-Garcia, Jorge Salguero, Moisés Batista, Leandro González‐Rovira, Irene Del Sol
Cited by: 5
References: 90

Abstract

Wire Arc Additive Manufacturing (WAAM) has gained attention as a metal additive manufacturing process producing complex large-scale components with high deposition rates and lower costs. Cold Metal Transfer (CMT) offers reduced heat input and enhanced control of metal transfer, making it suitable for aluminium. This review analyses CMT-based WAAM with a focus on Al–Si alloys, providing a synthesis for this material system and establishing a structured comparison of representative studies on process fundamentals, arc mode variants, and key processing parameters. The influence of electrical and kinematic parameters and thermal management on process and geometrical stability, microstructural evolution, defect formation, and mechanical behaviour is discussed. Process behaviour is governed by the temporal distribution of heat input within the CMT cycle and thermal history. Control of heat input can reduce porosity, microstructural heterogeneity, and geometric instability, while advanced CMT modes can improve process stability and material efficiency under appropriate process configurations. Mechanical performance depends on the interaction between process parameters, microstructure, and defects, leading to variability and anisotropy. Despite progress, challenges related to process repeatability, narrow processing windows, defect susceptibility, and predictive capability remain. Future research should focus on parameter optimization, integrated modelling, real-time control, and WAAM-specific alloys to enable reliable industrial implementation.

Fields of Study & Subjects

Additive Manufacturing Materials and Processes High Entropy Alloys Studies Advanced Welding Techniques Analysis

Publication details

Journal / source
Machines
Publisher
MDPI AG
Volume
14
Issue
4
Pages
421–421
Publication date
10 April 2026
Language
EN