Enhanced Pressureless Sinter-Bonding of Ag Nanoparticle Paste Through In Situ Ag Complex Reduction

The high-temperature operating requirements and the issues in the packaging process of wide-bandgap power semiconductors have positioned pressureless sinter-bonding using Ag nanoparticle paste as the most promising die-attach technology. However, under pressureless conditions, where externally applied pressure-driven particle rearrangement is absent, achieving sufficient densification and suppressing residual porosity during short-duration annealing at 250 °C remain significant challenges for conventional single-composition Ag pastes. In this study, a hybrid filler paste composed of Ag nanoparticles and a Ag complex solution was developed to implement an active mass supply strategy, in which additional Ag atoms were directly introduced into interparticle voids through in situ reduction during sinter-bonding. Mono-dispersed Ag nanoparticles with a mean diameter of 75.26 nm were synthesized via H2O2-mediated wet-chemical reduction, and the Ag complex solution was prepared using a Ag salt–complexing agent–formic acid system dispersed in an ethylene glycol medium. TG-DTA analysis of the hybrid paste revealed four sequential thermal stages, consisting of solvent evaporation, Ag ion reduction, organic decomposition, and interparticle sintering, accompanied by approximately 16 wt% out-gassing. Based on these results, a three-step temperature profile was designed to initiate sintering after complete out-gassing. When chip/paste/substrate assemblies, pre-dried at 50 °C for 90 s and pre-compressed at 5 MPa for 60 s, were subjected to the three-step profile with a peak temperature of 250 °C, the in situ reduced Ag effectively bridged adjacent nanoparticles and filled fine interparticle voids, leading to pronounced densification of the bond line. As a result, the hybrid paste achieved an average shear strength of 19.1 MPa, exceeding the minimum requirement for sinter-bonding applications. These findings demonstrate that the proposed hybrid filler approach provides an effective pathway for enhancing pressureless Ag sinter-bonding performance.