Lightweight Semantic-Guided FCOS for In-Line Micro-Defect Inspection in Semiconductor Manufacturing

Read full text
Authors: Tao Zhang, Shichang Yan, Gaoe Qin
Cited by: 1
References: 39

Abstract

The relentless miniaturization of semiconductor components and Printed Circuit Boards (PCBs) has rendered Automated Optical Inspection (AOI) of micro-defects a critical bottleneck in modern manufacturing and metrology. While in-line inspection systems offer economically viable and scalable quality control solutions, they impose stringent constraints on both inference latency and detection robustness-particularly for diminutive, sparsely distributed defects (e.g., mouse bites, pinholes) amidst complex, repetitive circuit topologies. To bridge this gap, we present a semantic-enhanced FCOS framework specifically engineered for micro-defect inspection. Our approach introduces two synergistic innovations: (1) a Semantic-Guided Upsampling Unit (SGU) that adaptively reweights channel-spatial features to reconcile the semantic disparity between shallow textural details and deep contextual representations; and (2) a Sparse Center-ness Calibration (SCC) module that enforces high-confidence, spatially sparse supervision to sharpen localization precision and suppress false positives. The SGU is integrated within a Progressive Semantic-Enhanced Feature Pyramid Network (PSE-FPN) that extends multi-scale representations to stride-4 (P2) resolution, while the SCC module is embedded directly into the detection head. Comprehensive evaluations on MS COCO and the real-world DeepPCB dataset validate the efficacy of our design. On COCO, our model achieves 41.8% AP with real-time throughput of 28 FPS on a single NVIDIA 1080Ti GPU. A lightweight variant further attains 41.6% AP at 42 FPS, accommodating high-throughput production environments. For PCB defect detection, the framework delivers 98.7% mAP@0.5, substantially outperforming contemporary detectors. These results demonstrate that semantics-aware, lightweight architectures enable scalable, real-time quality assurance in semiconductor manufacturing.

Fields of Study & Subjects

Industrial Vision Systems and Defect Detection Advanced Neural Network Applications Infrastructure Maintenance and Monitoring

Publication details

Journal / source
Micromachines
Publisher
MDPI AG
Volume
17
Issue
4
Pages
473–473
Publication date
14 April 2026
Language
EN