Functionalization of Photopolymer with Laser-Ablated Copper NPs: A Comprehensive Study of ROS Generation, Antimicrobial Activity and Cytotoxic Profile

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Authors: Dmitriy E. Burmistrov, Dmitriy A. Serov, Lev R. Sizov, Maxim E. Astashev, Ekaterina E. Karmanova, Ilya V. Baimler, Alexander V. Simakin, Dmitry N. Ignatenko, Fatikh M. Yanbaev, Evgeny V. Kuzmin, Sergey V. Gudkov
Cited by: 1
References: 86

Abstract

This study addresses the critical need for advanced biomedical materials that possess both potent antimicrobial properties and high biocompatibility to prevent device-related infections and promote healing. To this end, we demonstrate the successful development and comprehensive characterization of functional composite materials based on a photopolymerizable acrylate resin modified with laser-ablated copper nanoparticles (Cu NPs). The synthesized Cu NPs exhibited a monomodal size distribution with a peak at 47 nm, a high zeta potential of −33 mV, and a spherical morphology. Incorporation of Cu NPs into the polymer matrix via Masked Stereolithography (MSLA) enabled the fabrication of complex structures that maintained high surface quality and optical transparency after polishing. Modification of photopolymer resin with Cu NPs significantly increased the strength of the resulting products and caused dose-dependent formation of reactive oxygen species (ROS). The resulting composite materials exhibited strong antibacterial activity against E. coli. Crucially, despite their potent antimicrobial efficacy, the materials showed no cytotoxicity towards human fibroblast cultures. These results highlight the potential of these composites for a new generation of biomedical applications, such as implantable devices and wound coatings, which combine programmable antimicrobial activity with high biocompatibility.

Fields of Study & Subjects

Laser-Ablation Synthesis of Nanoparticles Photopolymerization techniques and applications Laser Material Processing Techniques

Publication details

Journal / source
Polymers
Publisher
MDPI AG
Volume
18
Issue
2
Pages
238–238
Publication date
16 January 2026
Language
EN