Intelligent Disassembly System for PCB Components Integrating Multimodal Large Language Model and Multi-Agent Framework

The escalating volume of waste electrical and electronic equipment (WEEE) poses a significant global environmental challenge. The disassembly of printed circuit boards (PCBs), a critical step for resource recovery, remains inefficient due to limitations in the adaptability and dexterity of existing automated systems. This paper proposes an intelligent disassembly system for PCB components that integrates a multimodal large language model (MLLM) with a multi-agent framework. The MLLM serves as the system’s cognitive core, enabling high-level visual-language understanding and task planning by converting images into semantic descriptions and generating disassembly strategies. A state-of-the-art object detection algorithm (YOLOv13) is incorporated to provide fine-grained component localization. This high-level intelligence is seamlessly connected to low-level execution through a multi-agent framework that orchestrates collaborative dual robotic arms. One arm controls a heater for precise solder melting, while the other performs fine “probing-grasping” actions guided by real-time force feedback. Experiments were conducted on 30 decommissioned smart electricity meter PCBs, evaluating the system on recognition rate, capture rate, melting rate, and time consumption for seven component types. Results demonstrate that the system achieved a 100% melting rate across all components and high recognition rates (90–100%), validating its strengths in perception and thermal control. However, the capture rate varied significantly, highlighting the grasping of small, low-profile components as the primary bottleneck. This research presents a significant step towards autonomous, non-destructive e-waste recycling by effectively combining high-level cognitive intelligence with low-level robotic control, while also clearly identifying key areas for future improvement.