Generalized Vision-Based Coordinate Extraction Framework for EDA Layout Reports and PCB Optical Positioning
Abstract
Automated optical inspection (AOI) technologies are widely used in PCB and semiconductor manufacturing to improve accuracy and reduce human error during quality inspection. While existing AOI systems can perform defect detection, they often rely on pre-defined camera positions and lack flexibility for interactive inspection, especially when the operator needs to visually verify solder pad conditions or examine specific layout regions. This study focuses on the front-end optical positioning and inspection stage of the AOI workflow, providing an automated mechanism to link digitally generated layout reports from EDA layout tools with real PCB inspection tasks. The proposed system operates on component-placement reports exported by EDA layout environments and uses them to automatically guide the camera to the corresponding PCB coordinates. Since PCB design reports may vary in format and structure across EDA tools, this study proposes a vision-based extraction approach that employs Hough transform-based region detection and a CNN-based digit recognizer to recover component coordinates from visually rendered design data. A dual-axis sliding platform is driven through a hierarchical control architecture, where coarse positioning is performed via TB6600 stepper control and Bluetooth-based communication, while fine alignment is achieved through a non-contact, gesture-based interface designed for clean-room operation. A high-resolution autofocus camera subsequently displays the magnified solder pads on a large screen for operator verification. Experimental results show that the proposed platform provides accurate, repeatable, and intuitive optical positioning, improving inspection efficiency while maintaining operator ergonomics and system modularity. Rather than replacing defect-classification AOI systems, this work complements them by serving as a positioning-assisted inspection module for interactive and semi-automated PCB quality evaluation.
Fields of Study & Subjects
Industrial Vision Systems and Defect Detection
Image and Object Detection Techniques
Optical measurement and interference techniques
Publication details
- Journal / source
- Processes
- Publisher
- MDPI AG
- Volume
- 14
- Issue
- 2
- Pages
- 342–342
- Publication date
- 18 January 2026
- Language
- EN