AI-Driven Decimeter-Level Indoor Localization Using Single-Link Wi-Fi: Adaptive Clustering and Probabilistic Multipath Mitigation

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Authors: Li-Ping Tian, Chih-Min Yu, Li‐Chun Wang, Zhizhang David Chen
Cited by: 0
References: 25

Abstract

This paper presents an Artificial Intelligence (AI)-driven framework for high-precision indoor localization using single-link Wi-Fi channel state information (CSI), targeting real-time deployment in complex multipath environments. To overcome challenges such as signal distortion and environmental dynamics, the proposed system integrates adaptive and unsupervised intelligence modules into the localization pipeline. A refined two-stage time-of-flight (TOF) estimation method is introduced, combining a minimum-norm algorithm with a probability-weighted refinement mechanism that improves ranging accuracy under non-line-of-sight (NLOS) conditions. Simultaneously, an adaptive parameter-tuned DBSCAN algorithm is applied to angle-of-arrival (AOA) sequences, enabling unsupervised spatio-temporal clustering for stable direction estimation without requiring prior labels or environmental calibration. These AI-enabled components allow the system to dynamically suppress multipath interference, eliminate positioning ambiguity, and maintain robustness across diverse indoor layouts. Comprehensive experiments conducted on the Widar2.0 dataset demonstrate that the proposed method achieves decimeter-level accuracy with an average localization error of 0.63 m, outperforming existing methods such as "Widar2.0" and "Dynamic-MUSIC" in both accuracy and efficiency. This intelligent and lightweight architecture is fully compatible with commodity Wi-Fi hardware and offers significant potential for real-time human tracking, smart building navigation, and other location-aware AI applications.

Fields of Study & Subjects

Indoor and Outdoor Localization Technologies Optical Wireless Communication Technologies Direction-of-Arrival Estimation Techniques

Publication details

Journal / source
Sensors
Volume
26
Issue
2
Pages
642–642
Publication date
18 January 2026
Language
EN