A Low-Noise and High-Integration Readout IC with Pixel-Level Single-Ended CDS for Short-Wave Infrared Focal Plane Arrays

Improving sensitivity in short-wave infrared (SWIR) detection is crucial for low-signal applications, such as astronomy and hyperspectral imaging, which demand readout integrated circuits (ROICs) with minimal noise and high density. However, conventional differential pixels with correlated double sampling (CDS) are difficult to integrate due to spatial limitations. In order to tackle this issue, we propose a compact, pixel-level, single-ended charge-domain architecture. It integrates single-ended CDS within each pixel, guaranteeing compatibility with the integrate-while-read (IWR) mode while suppressing reset and 1/f noise. A capacitor reuse technique is also proposed to enable the integration capacitor to function as an auxiliary load, which optimizes the noise–area trade-off. Fabricated in 180 nm CMOS, our 1296 × 256 ROIC attains a noise floor of 0.50 mV (achieving a reduction of approximately 70% compared to conventional architectures under identical conditions), consumes under 200 mW, and operates at frequencies exceeding 200 Hz. It also exhibits great linearity (0.9999) and supports both integrate-then-read (ITR) mode and integrate-while-read (IWR) mode, while also providing a row-level gain selecting function. Validated at 15 μm pitch, this design provides an effective option for high-density SWIR systems.