BWD-DETR: A Robust Framework for Bright-Field Wafer Defect Detection

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Authors: Ruisu Zhang, Xiangji Guo, Ying Xu, Tianyu Zhang, Ming Ming
Cited by: 1
References: 32

Abstract

Optical defect detection based on bright-field imaging is currently one of the most widely applied inspection techniques in wafer fabrication. However, particle defects on the surface of patterned wafers are often small in size. Under bright-field optical imaging conditions, defect signals are easily overwhelmed by complex background textures and noise, seriously affecting the detectability and positioning accuracy of defects. To address this issue, this paper proposes BWD-DETR, a detection framework tailored for wafer surface defects under bright-field imaging. Based on the RT-DETR baseline, this framework integrates a wavelet backbone, an SMFI module, and a CAS-Fusion module, achieving an AP50 of 96.56% and an AP50:95 of 54.94% in bright-field wafer defect detection, with improvements of 1.64% and 2.17% over the baseline, respectively. The proposed method can effectively enhance the detection capability for sub-micron defects on the wafer surface.

Fields of Study & Subjects

Industrial Vision Systems and Defect Detection Surface Roughness and Optical Measurements Advanced Surface Polishing Techniques

Publication details

Journal / source
Sensors
Publisher
MDPI AG
Volume
26
Issue
3
Pages
1064–1064
Publication date
6 February 2026
Language
EN