Deep Learning to Automate Parameter Extraction and Model Fitting of Two-Dimensional Transistors

Read full text
Authors: Robert K. A. Bennett, Jan-Lucas Uslu, Harmon F. Gault, Asir Intisar Khan, Lauren Hoang, Tara Peña, Kathryn M. Neilson, Young Suh Song, Zheng Zhang, Andrew J. Mannix, Eric Pop
Cited by: 2
References: 29

Abstract

We present a deep learning approach to extract physical parameters (e.g., mobility, Schottky contact barrier height, and defect profiles) of two-dimensional (2D) transistors from electrical measurements, enabling automated parameter extraction and technology computer-aided design (TCAD) fitting. To facilitate this task, we implement a simple data augmentation and pretraining approach by training a secondary neural network to approximate a physics-based device simulator. This method enables high-quality fits after training the neural network on electrical data generated from physics-based simulations of ~500 devices, a factor >40× fewer than other recent efforts. Consequently, fitting can be achieved by training on physically rigorous TCAD models, including complex geometry, self-consistent transport, and electrostatic effects, and is not limited to computationally inexpensive compact models. We apply our approach to reverse-engineer key parameters from experimental monolayer WS 2 transistors, achieving a median coefficient of determination ( R 2 ) = 0.99 when fitting measured electrical data. We also demonstrate that this approach generalizes and scales well by reverse-engineering electrical data from high-electron-mobility transistors while fitting 35 parameters simultaneously. To facilitate future research on deep learning approaches for the inverse design of transistors, we have published our code and sample datasets online.

Fields of Study & Subjects

Advancements in Semiconductor Devices and Circuit Design VLSI and FPGA Design Techniques Low-power high-performance VLSI design

Publication details

Journal / source
Research
Publisher
American Association for the Advancement of Science (AAAS)
Volume
9
Pages
1103–1103
Publication date
1 January 2026
Language
EN