Numerical Simulation of Thermomechanical Material Behavior and Damage in Lead-Free Solders

PureMUL 2026 Thesis Open access

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Authors: Wolfgang Flachberger
DOI: 10.34901/mul.pub.2026.077
Cited by: 0

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Mechanical Behavior of Composites Fatigue and fracture mechanics

Publication details

Journal / source
PureMUL
Publication date
1 January 2026
Language
EN
Document type
Thesis