Design, simulation, fabrication, measurement, and analysis of 3D-printed radio frequency conductive structures

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Authors: Rachana Vokkethur
Cited by: 0

Abstract

Additive manufacturing has emerged as a disruptive technology in the field of electronics, offering new possibilities for the fabrication of complex, lightweight, and customizable components. Conventional PCB manufacturing relies on multi-step processes and is limited to planar geometries, making it less suitable for rapid prototyping or integration into non-standard surfaces. In contrast, Fused Deposition Modelling (FDM) provides a cost-effective and accessible approach to directly fabricate functional electronic structures by combining conductive and dielectric materials within a single printing process. This thesis examines the design, simulation, fabrication, measurement and analysis of 3D-printed conductive transmission lines utilising FDM technology. A conductive filament and a dielectric filament are employed to realise fully integrated microstrip and coaxial structures. Electromagnetic simulations are performed to optimise the geometry for RF performance, and the printed prototypes are experimentally characterised using vector network analyser measurements. The analysis focuses on the transmission coefficients and the reflection coefficients, providing insights into impedance matching, insertion loss, and frequency-dependent behaviour. These findings confirm that FDM-based additive manufacturing can produce functional RF structures with reliable performance, despite material and fabrication limitations. The work demonstrates the potential of 3D printing as a flexible and low-cost method for prototyping radio frequency components, highlighting future directions that include improved material characterisation, connector integration, and the design of more advanced components, such as filters and antennas.

Fields of Study & Subjects

Additive Manufacturing and 3D Printing Technologies Microwave Engineering and Waveguides Antenna Design and Analysis

Publication details

Journal / source
Ostbayerische Technische Hochschule Regensburg (OTH Regensburg)
Publication date
1 January 2026
Language
EN