Particle transport in sputter deposition process using argon or krypton gas: effect of thermalization on deposition rate and thickness uniformity
Abstract
Abstract The effects of sputtering gas on particle transport in DC magnetron sputtering have been studied. Using argon or krypton as sputtering gas, Al, Ti, Cu, or Mo targets were sputtered at gas pressures ranging from 0.5 to 20 Pa. The deposition rates at the front face were almost constant at low gas pressures, then decreased above a certain pressure. The thickness uniformity deteriorated with increasing gas pressure, and the backside deposition reached its maximum at the boundary pressure. The dependence of these behaviors on the gas and target materials was examined using thermalization behavior evaluated by Monte Carlo simulation.
Fields of Study & Subjects
Plasma Diagnostics and Applications
Metal and Thin Film Mechanics
Advanced Materials and Semiconductor Technologies
Publication details
- Journal / source
- Japanese Journal of Applied Physics
- Volume
- 65
- Issue
- 4
- Pages
- 040903–040903
- Publication date
- 6 February 2026