Development of a thin-film residual-stress measurement device using multi-folded structures
Abstract
Abstract We developed an on-chip residual-stress measurement device with a multi-folded spring to evaluate a 10 μm thick Ni–Nb–Zr thin-film metallic glass. To address the reduced critical buckling load in thin films, we tailored the stiffness anisotropy by decreasing the axial stiffness ( k x ) to suppress buckling while maintaining a high out-of-plane stiffness ( k z ) for structural stability. The device enabled in situ measurements of high compressive stress while maintaining a flatness of
Fields of Study & Subjects
Metallic Glasses and Amorphous Alloys
Advanced MEMS and NEMS Technologies
Metal and Thin Film Mechanics
Publication details
- Journal / source
- Japanese Journal of Applied Physics
- Publisher
- IOP Publishing
- Volume
- 65
- Issue
- 6
- Pages
- 06SP20–06SP20
- Publication date
- 5 March 2026