ANALYSIS OF THE FEK DELVOTEC 6400 WEDGE BONDING SYSTEM

Modern production of microelectronics and hybrid electronic modules is characterized by high requirements for the accuracy of interconnection formation, stability of technological parameters, and reliability of electrical contacts. Among the key factors influencing the quality of the wedge bonding process are the positioning accuracy of the bonding tool and the stability of ultrasonic impact during the formation of the bonded contact.