基于太赫兹技术的封装芯片缺陷无损检测研究进展

Chinese Journal of Lasers 2026

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Authors: 徐振 Xu Zhen, 罗曼 Luo Man, 梁博涵 Liang Bohan, 李吉宁 Li Jining, 张嘉昕 Zhang Jiaxin, 王坦 Wang Tan, 陈锴 Chen Kai, 徐德刚 XU Degang
DOI: 10.3788/cjl250714
Cited by: 2
References: 77

Fields of Study & Subjects

Military Technology and Strategies Legal and Regulatory Analysis Linguistic Cultural and Literary Studies

Publication details

Journal / source
Chinese Journal of Lasers
Publisher
Shanghai Institute of Optics and Fine Mechanics
Volume
53
Issue
2
Pages
0214003–0214003
Publication date
1 January 2026
Language
EN