硅通孔互连和球栅阵列封装的光学相控阵研究

Infrared and Laser Engineering 2026

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Authors: 封治华 Feng Zhihua, 张鹏 ZHANG Peng, 赵渊明 ZHAO Yuanming, 张鹏飞 ZHANG Pengfei, 冯吉军 FENG Jijun, 韩香娥 Han Xiang'e
DOI: 10.3788/irla20250473
Cited by: 0
References: 13

Fields of Study & Subjects

Semiconductor Lasers and Optical Devices Photonic and Optical Devices 3D IC and TSV technologies

Publication details

Journal / source
Infrared and Laser Engineering
Volume
55
Issue
1
Pages
20250473–20250473
Publication date
1 January 2026
Language
EN