Transient Behavior of Imperfectly Bonded Dissimilar Piezoelectric Layers Containing Multiple Embedded Cracks under Anti-Plane Electro-Mechanical Impact

This paper presents an analytical model for analyzing two bonded dissimilar piezoelectric materials weakened by multiple embedded cracks. The medium is subjected to anti-plane mechanical and in-plane electrical loading. We consider the interface imperfect to address potential electro-mechanical damage at the interface, with the electro-mechanical imperfection represented by a linear spring model. First, the solution for a dynamic electro-elastic dislocation in the piezoelectric layer is obtained using the integral transforms technique. Subsequently, the dislocation solutions are utilized to transform the problems into a set of singular integral equations featuring Cauchy kernels, which are then solved numerically in the Laplace transform domain. The numerical Laplace inversion technique calculates the dynamic stress intensity factors (DSIFs). Several examples are analyzed to derive DSIFs for varying crack lengths and the spring constants reflecting imperfect electro-mechanical bonding and the material properties of the piezoelectric layers.