Critical Issues of 3D High-Performance IC Integrations
Abstract
Moore’s law has been the most powerful driver for the development of the microelectronic industry. This law emphasizes on lithography scaling and integration (in 2D) of all functions on a single chip, perhaps through system-on-chip (SoC). On the other hand, the integration of all these functions can be achieved through system-in-package (SiP) or, ultimately, 3D IC integration. There are many critical issues of 3D IC integration, especially for 3D high-performance IC integrations. In this study, some of the critical issues of 3D high-performance IC integrations will be discussed and some potential solutions or research problems will be proposed.
Fields of Study & Subjects
3D IC and TSV technologies
Semiconductor materials and devices
Silicon and Solar Cell Technologies
Publication details
- Journal / source
- IMAPSource Proceedings
- Volume
- 2009
- Issue
- Symposium
- Pages
- 585
- Publication date
- 27 May 2026
- Language
- EN