True 3D Through Hole Interconnections Formed by Femto-second Laser Irradi-ation / Wet Etching and Molten Metal Suction Method
Abstract
We propose a new fabrication process, which can realize “true” 3D through-hole interconnections (THIs), using femto-second laser irradiation, wet etching and molten metal suction method (MMSM). “True” 3D through-hole interconnections defined here mean the through-holes having branches and/or cranked structures, which can NEVER be accomplished by the regular etching process such as deep reactive ion etching (DRIE). These structures would give us much more freedom to design THIs and expected to be applied to higher density and smaller packaging for micro electro mechanical systems (MEMS). We’ve successfully fabricated the “true” 3D THIs having the aspect ratio more than 9 in silica glass substrate.
Fields of Study & Subjects
Integrated Circuits and Semiconductor Failure Analysis
Laser Material Processing Techniques
Semiconductor materials and devices
Publication details
- Journal / source
- IMAPSource Proceedings
- Volume
- 2008
- Issue
- Symposium
- Pages
- 615–620
- Publication date
- 23 July 2026
- Language
- EN