Low Thermal Expansion and High Heat Dissipation Printed Wiring Boards
Abstract
It is important to find ways to reduce the size and weight of satellite power supplies. This goal requires the development of surface mounting technology, in which the devices supply high power while using large-scale ceramic packages. The technology has been developed to make printed wiring boards (PWBs) with high heat dissipation and low thermal expansion. However, conventional glass-epoxy and aluminum core PWBs do not provide enough high heat dissipation and low thermal expansion to develop reliable PWBs. In this study, therefore we attempted to develop a new type of core PWB by utilizing CFRP (Carbon Fiber Reinforced Plastics) in order to overcome the above problems. It has been confirmed that the CFRP core PWB developed shows higher heat dissipation and lower thermal expansion than the conventional PWBs.
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
3D IC and TSV technologies
Heat Transfer and Optimization
Publication details
- Journal / source
- IMAPSource Proceedings
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Volume
- 2008
- Issue
- Symposium
- Pages
- 889–894
- Publication date
- 27 July 2026
- Language
- EN