Nanoindentation load-displacement on SAC305+1-3Bi

This dataset supports a study on the mechanical behavior of SAC305 lead-free solder alloys with 1–3 wt.% bismuth (Bi) additions characterized by nanoindentation. The project aims to understand how Bi influences localized deformation, hardness, and strain-softening behavior for improving solder joint reliability in microelectronics. Nanoindentation experiments were performed using both Berkovich and cube-corner tips under constant strain rate loading to capture load-displacement responses across different effective plastic strains (~8% and ~22%). The dataset includes raw load-displacement curves, calculated hardness and modulus values, and post-indentation pile-up measurements. The results reveal a significant Bi-induced increase in hardness and enhanced strain-softening, linked to microstructural heterogeneity from Bi precipitates and intermetallics. This dataset provides valuable input for validating viscoplastic constitutive models and offers a geometry framework for quantifying mechanical behavior.