TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT WITH MULTIPLE OPENING SEALANT, 150 °C AND 200 °C
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Welding Techniques and Residual Stresses
Electrical and Thermal Properties of Materials
Publication details
- Publication date
- 28 January 2026