Encapsulation of Liquid Metal Particles for Next-Generation Stretchable Electronics
Fields of Study & Subjects
Nanomaterials and Printing Technologies
Advanced Sensor and Energy Harvesting Materials
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- Journal of Sensor Science and Technology
- Volume
- 35
- Issue
- 1
- Pages
- 67–85
- Publication date
- 31 January 2026
- Language
- EN