Co-Sputtering Ti-Ag-N Films: Structure, Wettability, and Antibacterial Properties

Incorporating silver (Ag) into titanium nitride (TiN) coatings is an effective strategy to enhance their structural integrity, mechanical strength, surface characteristics, and antibacterial activity. In this study, Ti–Ag–N coatings were deposited via DC magnetron sputtering using Ag plates with diameters of 0, 4, 6, and 8 mm. The resulting films were analyzed using XRD, SEM/EDS, hardness tests, and water contact angle measurements, while their antibacterial performance was tested against Staphylococcus aureus. Moderate Ag incorporation (Ag-6) yielded the best overall properties, improving crystallinity, producing a uniform Ag distribution, and increasing surface energy. This composition also demonstrated the highest hardness (179.24 VHN) and excellent wettability. Antibacterial tests confirmed that Ag-containing coatings - particularly Ag-6 - suppressed bacterial growth by up to 99.99%, mainly due to controlled Ag ion release and enhanced surface energy. These results indicate that optimizing Ag content effectively balances durability, functionality, and antibacterial performance, making Ti–Ag–N coatings promising candidates for biomedical and advanced engineering applications. HIGHLIGHTS Ti-Ag-N thin films were prepared by DC sputtering. Varying Ag content modified the crystallographic structure and surface energy. Increased Ag incorporation enhanced surface hydrophilicity. Antibacterial tests showed up to 99.99% inhibition against S. aureus. A strong link was found between structure, wettability, and antibacterial performance. GRAPHICAL ABSTRACT