Surface Modification for High-Reliability and Multi-Functional Hybrid Interconnections

Institutional Repositories DataBase (IRDB) 2026 Open access

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Authors: Akitsu Shigetou

DOI: 10.48505/nims.6154

Cited by: 0

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability