Advances and Challenges in Electrical IC, Substrate Materials and Assembly Technologies for Next-Generation CPO in Generative AI Systems

Journal of The Japan Institute of Electronics Packaging 2026

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Authors: Hitoshi Wakita

DOI: 10.5104/jiep.29.188

Cited by: 1

References: 4

Fields of Study & Subjects

Advanced Memory and Neural Computing Machine Learning in Materials Science Ferroelectric and Negative Capacitance Devices

References 4