Impact of Package Degradation on Short-Circuit Robustness and Temperature Stability during Application-Close Repetitive Switching of IGBTs
Fields of Study & Subjects
Silicon Carbide Semiconductor Technologies
Electromagnetic Compatibility and Noise Suppression
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- Univerlag
- Publication date
- 12 February 2026
- Language
- EN
- Document type
- Thesis