Decomposition of Glue Bonding in Glue-Laminated Timber Products by Water Intrusion and Fungal Decay

Prolonged exposure to moisture can foster the growth of decay fungi in wood and laminated products. Understanding the impact of decay on the performance of glue-laminated products is crucial for mitigating failure risks and facilitating the design of more durable structures. While studies have explored the effects of fungal attack on properties of various wood-based panels and composites, the influence of moisture intrusion and fungal attack in the glue line has received less attention. Research often focused on fungal effects on the assembly without examining the localized effects around the glue lines. Understanding localized changes around the glue line is critical because most interactions likely occur within the glue line. Simple decay tests measuring mass loss may not sufficiently explain changes in glue-laminated products, as they represent averages across an entire assembly. An alternative approach might be direct inoculation of the glue line with fungal cultures after several wetting and drying cycles to evaluate the effect of both water intrusion and mycelium growth in the glue line since the integrity of the glue line is crucial in the determination of physical and mechanical properties of glue-laminated timbers. Cite this article as: Nami Kartal, S., & Singh, T. (2026). Decomposition of glue bonding in glue-laminated timber products by water intrusion and fungal decay. Forestist, 76, 2612,10.5152/forestist.2026.252612.